We put Kevin Kilbuck, our director of strategic NAND marketing, in front of a whiteboard so we could get some high-level perspective on today’s Micron/Intel 25nm Triple Level Cell (TLC) NAND technology announcement. Is this brief video he reviews MLC, SLC, and TLC technology and demonstrates what a 25nm TLC NAND offers for consumer storage.
Watch to learn more.
Future Memory: What Will Replace DRAM? That’s the title for the panel I was asked to sit on at last week’s MemCon 2010 event. It may seem premature to think about replacing DRAM now (we still see several generations of DRAM development ahead with a long-term home in computing systems), until you think about HW and SW design cycles. Hardware platforms for 2015, 2016, and even 2017 are being developed right now. So we need to pick the best option that’s working today and start thinking about how we’ll use it, especially if it’s not drop-in compatible.
You can watch my arguments for why PCM will be that next-generation technology in this video. It was a great discussion, one that I’m happy to continue online—please post your comments and questions below.
Technology moves fast. It was only 14 months ago that we went into production with our world-leading 34nm process NAND, and we’ve already moved on to 25nm NAND. In this brief whiteboard video, I explain just how small 25nm is (3,000 times smaller than the diameter of a human hair) and why our ongoing quest to shrink process technology is vital to the future of storage.
Today, Micron and Intel announced 25nm NAND, the smallest, most advanced semiconductor process technology in the world. This achievement allows us to double the capacity of our highest-density MLC device, enabling up to 64GB in a single package and paving the way for big developments in storage, computing, and consumer electronics.
The video below features highlights from a presentation given by Intel and Micron executives at our 25nm announcement. Learn what our aggressive scaling strategy means for the future of storage and the next generations of NAND.
Let’s commemorate the close of the year with … a list!
OK, to be honest, ending the year with a Top 10 List is not very, um, well, innovative. But it’s what’s on our list that’s innovative. And the year 2009 for Micron and Lexar Media can be summarized like this: Bigger. Faster. Better.
So, that’s our Top 10 list for 2009, innovatively reduced to three memorable points.
Still not ready to let go of tradition? Then, on with the Micron and Lexar Top 10 Innovations of 2009 countdown:
We’ve had tremendous feedback from customers, partners, media and analysts on our Enterprise NAND announcement. So I thought I’d include a couple of perspectives from the industry on the potential impact of Enterprise NAND:
• “a significant milestone for the industry, one that’s likely to increase confidence in the technology.”
—Bob Merritt, analyst
InternetNews.com
• “proves wrong all those people who think that high-endurance devices will never be supported by advancing lithographies.”
—Jim Handy, analyst
Enterprise Storage Forum
• “Micron made a major announcement this week touting a new memory structure that simultaneously drives up the density and write performance of current Flash memory.”
IT Business Edge
Since introducing our 34nm NAND nearly a year ago, we’ve made big strides in both performance and reliability. Now, nearly all of our NAND products are built on 34nm—leading the industry in density and efficiency.
In fact, our 34nm process is so solid, we’ve even moved our super-high cycling Enterprise NAND parts to it. We just announced 34nm SLC and MLC Enterprise NAND parts that can hit 300,000 and 30,000 cycles, respectively. These new parts deliver unmatched density, cost-efficiency, and reliability and will open up new potential for NAND storage in enterprise applications. Watch my quick explanation below to understand why.
There’s been a lot of discussion lately about NAND in enterprise applications. Can NAND hit enterprise requirements? Will sub-40nm NAND ever serve this market? Is it really a compelling choice? Put simply: yes. Here are a few reasons why:
We’ve been getting great response from customers who’ve seen our NAND performance demonstration, so we wanted to share it with a wider audience.
The test pits our single- and dual-plane SLC devices and NANDCode™ FTL software against Samsung’s OneNAND™ running on Microsoft’s FTL. The test system is a TI OMAP™ 3430 development platform running Windows Mobile® 6.5 OS. We changed out the onboard NAND with a simple PISMO card swap and then ran a 10MB system performance test.
The results are impressive and undeniable. The key is our custom NANDCode FTL software, which enables advanced performance features like dual-plane programming.
Watch the video below to see why some of our competitors’ customers have been willing to open their design cycles to take advantage of the big NAND performance gains offered by Micron’s MCPs.
Visit our Web site to learn more about our NANDCode software and how you can use it to boost performance in your next mobile design.
Micron’s Kevin Kilbuck, director of strategic NAND marketing talks about the hottest buzz happening at this year’s FMS. It’s been a lively show this year, with an interesting debate about bringing high-quality NAND to enterprise applications, as well as a big announcement from us and Intel on 3-bit-per-cell MLC NAND technology. Let us know what you think about our interview with Kevin, and be sure to stay tuned for future news and updates.
